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 HANBit
HCPMEM-512
EDO DRAM Board 512Mbyte ( 32M x 144-Bit ) organized as 4Banks of 8Mx144, 4K Ref., 3.3V, ECC Part No. HCPMEM-512
GENERAL DESCRIPTION
The HCPMEM-512 is a 32M x 144 bit Dynamic RAM high-density module, organized with four banks of 8M x 144 bits. The HCPMEM-512 consists of thirty six 8M x 16, 4K refresh DRAMs in TSOPII packages, five 16 bit buffer/drivers and one PLD. The PLD controls the WRITE Enable and Output Enable signals to the DRAMS. Connectors on each side of the module allow two memories to mated together.
FEATURES
VTTL compatible inputs and outputs 10 bit Column addressing Single 3.3V +/- .3 power supply Buffered Address and Control lines Mezzanine stackingAccess time: 60 ns (max) Power dissipation * Active: 7.5 W (max) * Standby : 400 mW (max) (CMOS interface) EDO page mode capability CAS-before-RAS refreshRefresh cycles FR4-PCB design Application : Sun Microsystem CP 1400/1500
* The used device is HM5113165F-6
URL : www.hbe.co.kr
Rev. 1.0 (March, 2002)
1
HANBit Electronics Co.,Ltd.
HANBit
Pin Configuration (TOP)
J1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 GND D0 D1 D2 VDD D3 D4 D5 GND D6 D7 D8 VDD D9 D10 D11 GND D12 D13 D14 VDD D15 D16 D17 GND GND D18 D19 D20 VDD D21 D22 D23 GND D24 D25 D26 VDD D27 D28 D29 GND D30 D31 D32 VDD D33 D34 D35 GND 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 GND D36 D37 D38 VDD D39 D40 D41 GND D42 D43 D44 VDD D45 D46 D47 GND D48 D49 D50 VDD D51 D52 D53 GND GND D54 D55 D56 VDD D57 D58 D59 GND D60 D61 D62 VDD D63 D64 D65 GND D66 D67 D68 VDD D69 D70 D71 GND 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 GND D72 D73 D74 VDD D75 D76 D77 GND D78 D79 D80 VDD D81 D82 D83 GND D84 D85 D86 VDD D87 D88 D89 VDD VDD D90 D91 D92 VDD D93 D94 D95 GND D96 D97 D98 VDD D99 D100 D101 GND D102 D103 D104 VDD D105 D106 D107 GND J2 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 GND D108 D109 D110 VDD D111 D112 D113 GND D114 D115 D116 VDD D117 D118 D119 GND D120 D121 D122 VDD D123 D124 D125 GND GND D126 D127 D128 VDD D129 D130 D131 GND D132 D133 D134 VDD D135 D136 D137 GND D138 D139 D140 VDD D141 D142 D143 GND 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40
HCPMEM-512
J3 GND A0 A1 VDD A2 A3 GND A4 A5 VDD A6 A7 GND A8 A9 VDD A10 A11 GND A12 GND GND /RASB2_L NC VDD /RAST2_L NC GND /RAB3_L VDD VDD /RAST3_L GND GND /RASB0_L NC VDD /RAST0_L NC GND 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 GND /RASB1_L EN U1 3 VDD /RAST1_L GND GND /CAS0(0)_ /CAS0(1)_ VDD GND /CAS1(0)_ /CAS1(1)_ VDD VDD NC GND /WE0_L VDD VDD VDD XOE_L GND GND XOEA_L 50_60NS_RA VDD VDD NC GND TDI TDO VDD TMS1 VDD NC GND TCLK1 GND GND
URL : www.hbe.co.kr
Rev. 1.0 (March, 2002)
2
HANBit Electronics Co.,Ltd.
HANBit
Pin Configuration (BOTTOM)
J4 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 GND D0 D1 D2 VDD D3 D4 D5 GND D6 D7 D8 VDD D9 D10 D11 GND D12 D13 D14 VDD D15 D16 D17 GND GND D18 D19 D20 VDD D21 D22 D23 GND D24 D25 D26 VDD D27 D28 D29 GND D30 D31 D32 VDD D33 D34 D35 GND 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 GND D36 D37 D38 VDD D39 D40 D41 GND D42 D43 D44 VDD D45 D46 D47 GND D48 D49 D50 VDD D51 D52 D53 GND GND D54 D55 D56 VDD D57 D58 D59 GND D60 D61 D62 VDD D63 D64 D65 GND D66 D67 D68 VDD D69 D70 D71 GND 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 GND D72 D73 D74 VDD D75 D76 D77 GND D78 D79 D80 VDD D81 D82 D83 GND D84 D85 D86 VDD D87 D88 D89 VDD VDD D90 D91 D92 VDD D93 D94 D95 GND D96 D97 D98 VDD D99 D100 D101 GND D102 D103 D104 VDD D105 D106 D107 GND J5 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 GND D108 D109 D110 VDD D111 D112 D113 GND D114 D115 D116 VDD D117 D118 D119 GND D120 D121 D122 VDD D123 D124 D125 GND GND D126 D127 D128 VDD D129 D130 D131 GND D132 D133 D134 VDD D135 D136 D137 GND D138 D139 D140 VDD D141 D142 D143 GND 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40
HCPMEM-512
J6 GND A0 A1 VDD A2 A3 GND A4 A5 VDD A6 A7 GND A8 A9 VDD A10 A11 GND A12 GND GND /RASB0_L NC VDD /RAST0_L NC GND /RAB1_L VDD VDD /RAST1_L GND GND /RASB2_L NC VDD /RAST2_L NC GND 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 GND /RASB3_L EN U1 3 VDD /RAST3_L GND GND /CAS0(0)_ /CAS0(1)_ VDD GND /CAS1(0)_ /CAS1(1)_ VDD VDD NC GND /WE0_L VDD VDD VDD XOE_L GND GND XOEA_L 50_60NS_RA VDD VDD NC GND TDI TDO VDD TMS1 VDD NC GND TCLK1 GND GND
URL : www.hbe.co.kr
Rev. 1.0 (March, 2002)
3
HANBit Electronics Co.,Ltd.
HANBit
HCPMEM-512
FUNCTIONAL BLOCK DIAGRAM
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Rev. 1.0 (March, 2002)
4
HANBit Electronics Co.,Ltd.
HANBit
ABSOLUTE MAXIMUM RATINGS
HCPMEM-512
Notes : Permanent device damage may occur if " Absolute Maximum Ratings" are exceeded. Functional operation should be restricted to the conditions as detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
DC OPERATING CONDITIONS
(Recommended operating conditions (Voltage referenced to VSS = 0V, TA = 0 to 70 C)
Notes : 1. All voltage referred to VSS . 2. The supply voltage with all VCC pins must be on the same level. The supply voltage with all VSS pins must be on the same level.
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Rev. 1.0 (March, 2002)
5
HANBit Electronics Co.,Ltd.
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DC CHARACTERISTICS
(Recommended operating condition unless otherwise noted, TA = 0 to 70 C)
HCPMEM-512
450
Notes : 1. Icc depends on output load condition when the device is selected. Icc max is specified at the output open condition. 2. Address can be changed once or less while RAS = VIL. 3. Measured with one sequential address change per EDO cycle, tHPC. 4. VIH VCC - 0.2V, 0 V VIL 0.2 V.
CAPACITANCE (TA = 25 C, V CC = 3.3 V 0.3 V)
Notes : 1. Capacitance measured with Boonton Meter or effective capacitance measuring method. 2. /RAS, /UCAS AND /LCAS = VIH TO DISABLE DOUT.
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Rev. 1.0 (March, 2002)
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AC Characteristics (Ta = 0 to +70 C, V = 3.3 V 0.3 V, V = 0 V)
Test Conditions *Input rise and fall time: 2 ns *Input pulse levels: VIL = 0 V, VIH = 3.0 V *Input timing reference levels: 0.8 V, 2.0 V *Output timing reference levels: 0.8 V, 2.0 V *Output load: 1 TTL gate + CL (100 pF) (Including scope and jig)
HCPMEM-512
Read, Write, Read-Modify-Write and Refresh Cycles (Common parameters)
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Rev. 1.0 (March, 2002)
7
HANBit Electronics Co.,Ltd.
HANBit
Read Cycle
HCPMEM-512
Write Cycle
URL : www.hbe.co.kr
Rev. 1.0 (March, 2002)
8
HANBit Electronics Co.,Ltd.
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Read-Modify-Write Cycle
HCPMEM-512
Refresh Cycle
EDO Page Mode Cycle
EDO Page Mode Read-Modify-Write Cycle
URL : www.hbe.co.kr
Rev. 1.0 (March, 2002)
9
HANBit Electronics Co.,Ltd.
HANBit
HCPMEM-512
Notes: 1. 2. 3.
4.
5. 6. 7. 8. 9. 10. 11. 12. 13. 14.
15. 16. 17. 18. 19.
20.
21.
22. 23.
24. 25. 26. 27.
AC measurements assume tT = 2 ns. An initial pause of 200 is required after power up followed by a minimum of eight initialization cycles (any s combination of cycles containing /RAS-only refresh or /CAS -before-/RAS refresh). Operation with the tRCD (max) limit insures that tRAC (max) can be met, tRCD (max) is specified as a reference point only; if tRCD is greater than the specified tRCD (max) limit, than the access time is controlled exclusively by tCAC . Operation with the tRAD (max) limit insures that tRAC (max) can be met, tRAD (max) is specified as a reference point only; if tRAD is greater than the specified tRAD (max) limit, then access time is controlled exclusively by tAA . Either tOED or tCDD must be satisfied. Either tDZO or tDZC must be satisfied. VIH (min) and VIL (max) are reference levels for measuring timing of input signals. Also, transition times are measured between VIH (min) and VIL (max). Assumes that tRCD tRCD (max) and tRAD tRAD (max). If tRCD or tRAD is greater than the maximum recommended value shown in this table, tRAC exceeds the value shown. Measured with a load circuit equivalent to 1 TTL loads and 100 pF. Assumes that tRCD tRCD (max) and tRCD + tCAC (max) tRAD + tAA (max). Assumes that tRAD tRAD (max) and tRCD + tCAC (max) tRAD + tAA (max). Either tRCH or tRRH must be satisfied for a read cycles. tOFF (max), tOEZ (max), tWEZ (max) and tOFR (max) define the time at which the outputs achieve the open circuit condition and are not referred to output voltage levels. tWCS , tRWD , tCWD , tAWD and tCPW are not restrictive operating parameters. They are included in the data sheet as electrical characteristics only; if tWCS tWCS (min), the cycle is an early write cycle and the data out pin will remain open circuit (high impedance) throughout the entire cycle; if tRWD tRWD (min), tCWD tCWD (min), and tAWD tAWD (min), or tCWD tCWD (min), tAWD tAWD (min) and tCPW tCPW (min), the cycle is a read-modify-write and the data output will contain data read from the selected cell; if neither of the above sets of conditions is satisfied, the condition of the data out (at access time) is indeterminate. tDS and tDH are referred to /UCAS and /LCAS leading edge in early write cycles and to /WE leading edge in delayed write or read-modify-write cycles. tRASP defines /RAS pulse width in EDO page mode cycles. Access time is determined by the longest among tAA , tCAC and tCPA . In delayed write or read-modify-write cycles, /OE must disable output buffer prior to applying data to the device. When output buffers are enabled once, sustain the low impedance state until valid data is obtained. When output buffer is turned on and off within a very short time, generally it causes large Vcc /Vss line noise, which causes to degrade VIH min/VIL max level. tHPC (min) can be achieved during a series of EDO page mode write cycles or EDO page mode read cycles. If both write and read operation are mixed in a EDO page mode /RAS cycle (EDO page mode mix cycle (1), (2)), minimum value of /CAS cycle (tCAS + tCP + 2 tT ) becomes greater than the specified tHPC (min) value. The value of CAS cycle time of mixed EDO page mode is shown in EDO page mode mix cycle (1) and (2). Data output turns off and becomes high impedance from later rising edge of /RAS and /CAS . Hold time and turn off time are specified by the timing specifications of later rising edge of /RAS and /CAS between tOHR and tOH and between tOFR and tOFF . tDOH defines the time at which the output level go cross. VOL = 0.8 V, VOH = 2.0 V of output timing reference level. Before and after self refresh mode, execute CBR refresh to all refresh addresses in or within 64 ms period on the condition a and b below. a. Enter self refresh mode within 15.6 after either burst refresh or distributed refresh at qual interval to all s refresh addresses are completed. b. Start burst refresh or distributed refresh at equal interval to all refresh addresses within 15.6 after exiting s from self refresh mode. In case of entering from /RAS -only-refresh, it is necessary to execute CBR refresh before and after self refresh mode according as note 23. At tRASS > 100 self refresh mode is activated, and not activated at tRASS < 10 It is undefined within the s, s. range of 10 tRASS 100 For tRASS 10 it is necessary to satisfy tRPS . s s. s, tASC , tCAH , tRCS , tWCS , tWCH , tCSR , tRPC , tCRP , tCHR , tRCH , tCPA , tCPW , tCWL , tDH , tDS , tCHS and tCP are determined by each of /UCAS /LACS independently. XXX : H or L (H: VIH (min) VIN VIH (max), L: VIL (min) VIN VIL (max)) /////// : Invalid Dout When the address, clock and input pins are not described on timing waveforms, their pins must be applied VIH or VIL .
URL : www.hbe.co.kr
Rev. 1.0 (March, 2002)
10
HANBit Electronics Co.,Ltd.
HANBit
HCPMEM-512
TIMING DIAGRAMS CAS -Before-RAS Refresh Cycle
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Rev. 1.0 (March, 2002)
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Hidden Refresh Cycle
HCPMEM-512
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Rev. 1.0 (March, 2002)
12
HANBit Electronics Co.,Ltd.
HANBit
EDO Page Mode Read Cycle (1)
HCPMEM-512
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Rev. 1.0 (March, 2002)
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HANBit Electronics Co.,Ltd.
HANBit
EDO Page Mode Read Cycle (2)
HCPMEM-512
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Rev. 1.0 (March, 2002)
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EDO Page Mode Early Write Cycle
HCPMEM-512
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Rev. 1.0 (March, 2002)
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EDO Page Mode Delayed Write Cycle*18
HCPMEM-512
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Rev. 1.0 (March, 2002)
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EDO Page Mode Read-Modify-Write Cycle*18
HCPMEM-512
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Rev. 1.0 (March, 2002)
17
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EDO Page Mode Mix Cycle (1) * 20
HCPMEM-512
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Rev. 1.0 (March, 2002)
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EDO Page Mode Mix Cycle (2)*20
HCPMEM-512
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Rev. 1.0 (March, 2002)
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PACKAGING INFORMATION
Unit : Mil [ Milimeter ]
HCPMEM-512
URL : www.hbe.co.kr
Rev. 1.0 (March, 2002)
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ORDERING INFORMATION
HCPMEM-512
Part Number
Density
Org.
Package
Mode
Ref
Vcc
SPEED
HCPMEM-512
512MByte
32MX 144bit
Mezzanine
EDO
4K
3.3V
60ns
URL : www.hbe.co.kr
Rev. 1.0 (March, 2002)
21
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